CHIP PACKAGING MANUAL An Introduction to Semiconductor Assembly Operations By: Peter Van Zant and Donald Mason © 1987 $12.50 Originally written as a companion study guide for our "Chip Packaging Part I & II" video training course, this text is an excellent introduction to semiconductor assembly operations. Information from the video is presented in written form to help facilitate learning and as a quick reference. Topics include: key terms and concepts, chip characteristics, an overview of packaging operations, pre-packaging wafer preparation, cleanliness and static control, package functions, and design. Contains a review section and quiz questions. 40 pages, spiral bound, separately purchasable companion study guide to video © 1987, published by Semiconductor Services Related material: Chip Packaging Video Order Form Semiconductor Services 2269 Chestnut St. #735 San Francisco, CA 94123 Tel:(650) 369-7890 Fax:(415) 346-8099 moreinfo@semiconductorservices.com