A three day course, presenting a detailed discussion of the current technologies offered by the major etcher manufacturers.

The focus of the course is to improve the effectiveness of all etch process and maintenance personnel by developing a fundamental understanding of these technologies.

The course is composed of in-depth practical insights and techniques that can be put to use in the fab right away. It also provides a thorough etch process knowledge base for those new to etch or new to the industry.

This course is a compilation of the actual fab experiences of process engineers, technicians, and service personnel from all over the world.

The seminar's Panel of Advisors is comprised of working professionals in the semiconductor industry with as much as thirty-five years in the industry.

WHAT YOU WILL LEARN

• An overview of the materials science used to make MOS devices
• The principles of six or more different plasma sources - the theory, advantages and disadvantages
• Specific processes for each principle etch application and why they work
• What can go wrong - the effects on the wafer of variations in each etch parameter and new hardware developments and effects
• How to design new processes - trouble shoot etcher problems and avoid common mistakes in etcher use

WHO SHOULD ATTEND

• Fab engineers and technicians who are new to etch equipment, etching, or IC fabrication
• Everyone interested in obtaining a thorough understanding of plasma etch
• Design engineers, EE's, MechE's, and software engineers who want to understand etching

Please contact us for more information.

Course Instructor

• Richard Yanda