CHIP PACKAGING Video Training Course © 1988 $495.00 A comprehensive overview of the "Back End" test and assembly processes. This video training course reviews chip characteristics and summarizes package functions. Both manual and automated methods are presented for the complete series of steps beginning with wafer sort and concluding with final test. Topics Cleanliness and Static Control Wafer Sort Wafer Thinning Backside Gold Package Design and Use Hermeticity Die Separation Die Pick Die Attach Wire Bonding Sealing Lead Plating and Trim Marking Final Test one tape, two parts, 61 minutes Order Form Semiconductor Services 2269 Chestnut St. #735 San Francisco, CA 94123 Tel:(650) 369-7890 Fax:(415) 346-8099 moreinfo@semiconductorservices.com