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FUNDAMENTALS OF MASK MAKING
Video Training Series
© 1991
$5,000.00

This unique video tutorial combines the advantages of professional training with the flexibility of in-house use for individuals or groups.

The blending of lecture, graphics, and live process footage provides a valuable teaching aid for persons involved in the mask manufacturing process, including suppliers.

Reynolds Consulting, which serves the mask making industry and its suppliers, joined with Semiconductor Services to produce this valuable training course. Jim Reynolds, the course lecturer and founder of Reynolds Consulting, has presented this course for BACUS tutorial sessions, at numerous SPIE Microlithography conferences, and at many individual companies who supply mask manufacturers. His background includes ten years of device fabrication at Fairchild and nine years as vice president of engineering at MicroMask.

The series consists of Mask Shop Tour and nine lecture segments.

Includes a workbook, which serves as a master set of handouts, and a course material duplication license for in-house use.

ten tapes in complete series
sessions may be purchased separately, see pricing below



Segment Outlines

Segment One: Mask Shop Tour

Mask Shop Tour gives an excellent orientation for those who need a basic knowledge of the mask manufacturing process. The video was taped at DuPont Photomasks and Hewlett-Packard. Topics are: data preparation, e-beam mask exposure, developing, CD measurement, descum, etch, strip, laser mask writing, optical imaging, defect inspection, repair, metrology, mask cleaning, pellicle application, contamination, inspection, contact prints, and film copies.

Segment Two: Mask Types

The Mask Types segment describes four wafer imaging tools, the contact printer, 1x projection aligner and 1x and 5x wafer steppers. Mask requirements and implications of their use in the imaging tools are presented.

Segment Three: Optical Mask Making

This segment addresses the optical mask fabrication process including data preparation, use of pattern generators and step-and-repeat imaging system, and options of emulsion or chrome plates. Mask blank manufacturing and pellicles are also discussed.

Segment Four: E-Beam Mask Making

The third segment describes the equipment and processes used in generating masks and reticles using an electron beam exposure system. Topics include a detailed description of the MEBES raster scan system, e-beam writing strategy, and e-beam resist processing.

Segment Five: Laser Mask Writing

The equipment and processes used to generate masks and reticles with laser imaging is presented in this segment. A detailed description of the ATEQ(ETEC) CORE writing sdystem and its imagining strategy is discussed. Optical imaging is also discussed.

Segment Six: Mask Inspection

ìMask Inspectionî describes the equipment and techniques used to measure feature sizes, evaluate registration, and identify defects on photomasks and reticles. The characteristics and capabilities of each type of equipment is explored. Common mask inspection procedures are discussed.

Segment Seven: Mask Repair

The equipment and procedures used to repair clear and opaque defects are presented in the sixth segment. The characteristics and capabilities of the repair equipment is explored and common repair techniques are discussed.

Segment Eight: Specifications

This segment provides a detailed description of how masks are specified. Statistical and practical definitions are used to define the terms used in the specifications. Common specifications for photomasks and reticles are supplied.


Segment Nine: Practical Issues

The areas of mask technology which depend more on people than on equipment are covered in this segment. Mask cleaning, the mask making environment, and the information required for purchasing masks is included.

Segment Ten: Phase Shift Masks

New fabrication and inspection techniques are required for phase shift masks. This segment discusses the theory and benefits of phase shift masks. The types of phase shift masks, the processes used to make them and their advantages and disadvantages are described. Since the use of phase shift masks extends the capability of optical imaging systems used to expose wafers, ìPhase Shift Masksî is particularly valuable.


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